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Title:
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Impact of materials on back-contact module reliability
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Author(s):
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Published by:
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Publication date:
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ECN
Solar Energy
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21-6-2010
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ECN report number:
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Document type:
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ECN-M--10-028
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Conference Paper
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Number of pages:
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Full text:
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4
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Download PDF
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Presented at: 35th IEEE Photovoltaic Specialist Conference, Honolulu, USA, 20-25 juni 2010.
Abstract:
This paper discusses the impact of several combinations of encapsulants, conductive adhesives and back-sheet foils on ECN’s back-contact modules performance and reliability. Damp-heat (85°C; 85% R.H) and thermal cycling (-40°C; +85°C) tests were performed up to twice as long as described in the IEC-61215 standard, i.e. 2000 hours of damp-heat and 400 thermal cycles. These tests have been identified as the most important tests for this technology. After climatic chamber testing, the modules were analyzed visually and by electro-luminescence imaging.
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