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ECN publication
Metal wrap through silicon heterojunction solar cells and first made minimodules
Wu, Y.; Aken, B.B. van; Janssen, G.J.M.; Loffler, J.; Li, F.; Shen, Y.; Yang, W.; Shi, J.; Li, Gaofei; Hu, Zhiyan; Xiong, Jingfeng; Coletti, G.
Published by: Publication date:
ECN Solar Energy 22-9-2014
ECN report number: Document type:
ECN-M--14-048 Conference Paper
Number of pages: Full text:
6 Download PDF  

In this paper we present the successful integration of a silicon heterojunction (HJ) solar cell with metal wrap through architecture (MWT) and foil based- back contact module technology. With this contribution we show a record cell efficiency of 20.3% achieved using commercial n-type Cz 6 inch wafers and demonstrate an encapsulated cell efficiency of 19.6% achieved on a 2×2 mini-module. To our knowledge this is the first time that module results of MWT-HJ architecture have been reported. In this studies , we propose a method to increase the solar cell performance up to 21% together with a 50% cost of ownership reduction of the front silver metal including via and conductive adhesive. This is possible solely by the optimization of the front metal grid. MWT-HJ is a fully low-temperature integrated cell and module concept compatible also with thinner wafers.

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