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Title:
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Metallisation patterns for interconnection through holes
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Author(s):
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Published by:
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Publication date:
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ECN
Solar Energy
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1-7-1999
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ECN report number:
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Document type:
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ECN-RX--99-025
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Article (scientific)
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Number of pages:
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4
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Published in: Paper to be published in the Technical Digest of the 11th Int. Photovoltaic Science and Engineering Conference, September 20-24, (), , , Vol., p.-.
Abstract:
ECN has developed a new cell- and module design for crystalline siliconsolar cells called PUM (pin-up module) based on an old patent. In this design
a limited number of holes (typically 9 or 16) is used to interconnect the
front side metallisation to a foil at the rear side by using pins. In this
way the busbars at the front side are eliminated, thus reducing shadow
losses. The practical aspects and results on cells and small modules of this
new design are presented. In this paper we discuss the design of the
metallisation pattern for the cells. A theoretical analysis is presented that
shows the gains of the PUM design over conventional cells. 5 refs.
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