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ECN publication
Title:
Metallisation patterns for interconnection through holes
 
Author(s):
Burgers, A.R.; Bultman, J.H.; Tip, A.C.; Sinke, W.C.
 
Published by: Publication date:
ECN Solar Energy 1-7-1999
 
ECN report number: Document type:
ECN-RX--99-025 Article (scientific)
 
Number of pages:
4  

Published in: Paper to be published in the Technical Digest of the 11th Int. Photovoltaic Science and Engineering Conference, September 20-24, (), , , Vol., p.-.

Abstract:
ECN has developed a new cell- and module design for crystalline siliconsolar cells called PUM (pin-up module) based on an old patent. In this design a limited number of holes (typically 9 or 16) is used to interconnect the front side metallisation to a foil at the rear side by using pins. In this way the busbars at the front side are eliminated, thus reducing shadow losses. The practical aspects and results on cells and small modules of this new design are presented. In this paper we discuss the design of the metallisation pattern for the cells. A theoretical analysis is presented that shows the gains of the PUM design over conventional cells. 5 refs.


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