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Title:
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Conductive adhesives for low-stress interconnection of thin back-contact solar cells
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Author(s):
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Eikelboom, D.W.K.; Bultman, J.H.; Schönecker, A.; Meuwissen, M.H.H.; Nieuwenhof, M.A.C.J. van den; Meier, D.L.
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Published by:
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Publication date:
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ECN
Solar Energy
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1-5-2002
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ECN report number:
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Document type:
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ECN-RX--02-027
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Conference Paper
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Number of pages:
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Full text:
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4
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Download PDF
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Presented at: 29th IEEE Photovoltaic Specialists Conference, New Orleans, USA, 20-24 mei 2002.
Abstract:
Thin crystalline silicon solar cells cannot be interconnected with standardsoldering techniques because of warping and breakage. Interconnection
with
conductive adhesives showed excellent behavior: warping can be avoided
and 80µm thin cells do not break during and after interconnection. Contact
resistances
measured on glued interconnections are similar to soldered contacts.
Damp/heat tests show no degradation after 2500 hours at 85°C/85°C humidity.
Temperature
cycling -40/°C has shown no effects after 200 cycles. I-V measurements
of interconnected thin back-contact cells in mini modules show no loss
in fill factor. Test mini modules made with soldered back contacts and
glued front contacts show excellent performance even after over 900
cycles. Interconnection with conductive adhesives is a promising technique
combining excellent mechanica1 properties, good conductivity, durability,
and low process temperatures thus reducing stress.
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