Publications

Skip Navigation Links.
Recently Published
Expand per documenttypeper documenttype
Collapse per Unitper Unit
Expand Business DevelopmentBusiness Development
Expand Biomass & Energy EfficiencyBiomass & Energy Efficiency
Expand Policy StudiesPolicy Studies
Expand Corporate CommunicationsCorporate Communications
Expand CorporateCorporate
Expand Environment & Energy EngineeringEnvironment & Energy Engineering
Expand Program DevelopmentProgram Development
Expand Quality Safety Health and EnvironmentQuality Safety Health and Environment
Expand Strategy & PlanningStrategy & Planning
Expand Wind EnergyWind Energy
Collapse Solar EnergySolar Energy
2018
2017
2016
2015
2014
2013
2012
2011
2010
2009
2008
2007
2006
2005
2004
2003
2002
2001
2000
1999
1998
1997
Expand per Clusterper Cluster

Search for publications:


Limit search to the fields

ECN publication
Title:
Fast and easy single step module assembly for back-contacted c-si solar cells with conductive adhesives
 
Author(s):
Bultman, J.H.; Eikelboom, D.W.K.; Kinderman, R.; Tip, A.C.; Tool, C.J.J.; Weeber, A.W.; Nieuwenhof, M.A.C.J. van den; Schoofs, C.; Schuurmans, F.M.
 
Published by: Publication date:
ECN Solar Energy 1-5-2003
 
ECN report number: Document type:
ECN-RX--03-019 Conference Paper
 
Number of pages: Full text:
4 Download PDF  

Presented at: 3rd World Conference on Photovoltaic Energy Conversion, Osaka, Japan, 11-18 mei 2003.

Abstract:
The simplest way to produce a module of crystalline silicon solar cellsis with back-contacted cells that are glued on an interconnection foil using conductive adhesives. This foil also serves as environmental barrier at the rear of the module. The conductive adhesive is tuned to cure in the same cycle as the encapsulant. It is possible to interconnect the cells without any additional temperature curing in a single lamination step. The interconnection foil can be made for an acceptable cost price, as is shown in the paper. The savings in labor, a higher efficiency, and a yield increase will lead to a lower cost price for such a module. First results show that a module produced in a single step leads to similar fill factors as soldered modules.


Back to List