ECN publication
Title:
Selecting optimal interconnection methodology for easy and cost efficient manufacturing of the pin up module
 
Author(s):
Bultman, J.H.; Eikelboom, D.W.K.; Kinderman, R.; Tip, A.C.; Weeber, A.W.; Meuwissen, M.H.H.; Nieuwenhof, M.A.C.J. van den; Michiels, P.P.; Schoofs, C.; Schuurmans, F.M.
 
Published by: Publication date:
ECN Solar Energy 1-10-2002
 
ECN report number: Document type:
ECN-RX--02-051 Conference Paper
 
Number of pages: Full text:
4 Download PDF  

Presented at: PV in Europe - From PV Technology to Energy Solutions Conference and Exhibition, Rome, Italy, 7-11 oktober 2002.

Abstract:
Rear contacted solar cells are successfully glued onto an interconnectionfoil which also serves as the environmental barrier at the rear of the module. Resulting fill factors are similar to cells connected with strips that are soldered and glued. Glued cells are interconnected and laminated in a single step, which reduces labor to a minimum, reduces stress on the cells, and therefore could increase process yield. Considering these advantages, this concept has the potential to interconnect very thin cells without additional stress on the cells.


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