ECN publication
Title:
Quantifying surface damage by measuring mechanical strength of silicon wafers
 
Author(s):
 
Published by: Publication date:
ECN Solar Energy 1-6-2005
 
ECN report number: Document type:
ECN-RX--05-010 Conference Paper
 
Number of pages: Full text:
4 Download PDF  

Presented at: 20th European Photovoltaic Solar Energy Conference and Exhibition, Barcelona, Spain, 6-10 juni 2005.

Abstract:
Ring on ring test geometry reveals the great importance of the saw damage on the mechanical stability of as-cut and textured wafers. The initial surface defects make big and unexpected differences in the strength after a standard industrial acid etch. The measuring technique is very sensitive to the surface of the wafers rather than the edge. The influence of bulk defects is excluded too, by analysing the strength of wafers from different manufacturers. It permits to focus on the modification of mechanical stability by adaptations of, e.g., wafering or chemical treatment. The apparent critical crack length is introduced as an intuitive parameter to quantify the surface damage.


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