|
Title:
|
|
Beyond 16% efficient back-contact modules using Mc-Si wafers and conductive adhesive interconnection technology
|
|
|
|
Author(s):
|
Jong, P.C. de; Broek, K.M.; Kloos, M.J.H.; Späth, M.; Nieuwenhof, M.A.C.J. van den; Steijvers, H.L.A.H.; Meuwissen, M.H.H.
|
|
|
|
Published by:
|
Publication date:
|
|
ECN
Solar Energy
|
29-1-2007
|
|
|
|
ECN report number:
|
Document type:
|
|
ECN-M--07-016
|
Conference Paper
|
|
|
|
Number of pages:
|
Full text:
|
|
0
|
Download PDF
|
Presented at: 22nd European Photovoltaic Solar Energy Conference and Exhibition, Milan, Italy, 3-7 september 2007.
Abstract:
n.v.t.
Back to List