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ECN publication
Production of low cost back contact based PV modules
Goris, M.J.A.A.; Kikkert, B.W.J.; Kroon, J.M.; Rozema, K.; Bennett, I.J.; Verlaak, J.
Published by: Publication date:
ECN Solar Energy 24-6-2016
ECN report number: Document type:
ECN-M--16-005 Conference Paper
Number of pages: Full text:
6 Download PDF  

In this paper, two developments targeted at reducing the production cost of back-contact modules are presented. The first cost reduction potential is realised by replacing the conductive copper layer with aluminium with a very thin and locally applied copper coating using cold spray technology. This results in a 2% PV module cost saving while also meeting industrial requirements for production speed and reduction of contamination. Prototype mini-modules manufactured using this method have shown very good performances and passed selected IEC reliability tests (Damp Heat and Thermal Cycling).The second cost reduction comes from reduction of encapsulant usage. By using powder coating technology, encapsulant thicknesses below 100 microns can be achieved. This not only results in the reduction of encapsulant usage as compared to standard modules, but it also increases production flexibility. Application of powder coated encapsulant results in a cost reduction of 1%. An additional cost advantage of the implementation of thinner encapsulants is a reduction of conductive adhesive of at least 60%, which can result in an additional 2% cost reduction.

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