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ECN publication
Testing Interconnections using Conductive Adhesives for Application in PV Modules
Broek, K.M.; Jong, P.C. de; Kloos, M.J.H.; Nieuwenhof, M.A.C.J. van den; Bots, T.L.; Meuwissen, M.H.H.; Steijvers, H.L.A.H.
Published by: Publication date:
ECN Solar Energy 11-9-2006
ECN report number: Document type:
ECN-RX--06-033 Conference Paper
Number of pages: Full text:
6 Download PDF  

Presented at: 21st European Photovoltaic Solar Energy Conference and Exhibition, Dresden, Germany, 4-8 september 2006.

In current module production the electrical interconnections are soldered to the solar cells. For current modules with thin cells and new module concepts with back contact cells, the replacement of solder by conductive adhesives can be advantageous. However, the current IEC tests were developed for soldered interconnections, which have other failure mechanisms. Therefore, three additional tests have been developed for the testing of conductive adhesives to be used in solar modules. In combination with computer simulation techniques developed in the same project, the tests will contribute to a better understanding of failure mechanisms of PV modules with conductive adhesives.

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