ECN publication
Conductive adhesives for low-stress interconnection of thin back-contact solar cells
Eikelboom, D.W.K.; Bultman, J.H.; Schönecker, A.; Meuwissen, M.H.H.; Nieuwenhof, M.A.C.J. van den; Meier, D.L.
Published by: Publication date:
ECN Solar Energy 1-5-2002
ECN report number: Document type:
ECN-RX--02-027 Conference Paper
Number of pages: Full text:
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Presented at: 29th IEEE Photovoltaic Specialists Conference, New Orleans, USA, 20-24 mei 2002.

Thin crystalline silicon solar cells cannot be interconnected with standardsoldering techniques because of warping and breakage. Interconnection with conductive adhesives showed excellent behavior: warping can be avoided and 80µm thin cells do not break during and after interconnection. Contact resistances measured on glued interconnections are similar to soldered contacts. Damp/heat tests show no degradation after 2500 hours at 85°C/85°C humidity. Temperature cycling -40/°C has shown no effects after 200 cycles. I-V measurements of interconnected thin back-contact cells in mini modules show no loss in fill factor. Test mini modules made with soldered back contacts and glued front contacts show excellent performance even after over 900 cycles. Interconnection with conductive adhesives is a promising technique combining excellent mechanica1 properties, good conductivity, durability, and low process temperatures thus reducing stress.

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