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Title:
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Conductive adhesives for low-stress interconnection of thin back-contact solar cells
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Author(s):
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Eikelboom, D.W.K.; Bultman, J.H.; Schönecker, A.; Meuwissen, M.H.H.; Nieuwenhof, M.A.C.J. van den; Meier, D.L.
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Published by:
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Publication date:
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ECN
Solar Energy
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1-10-2002
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ECN report number:
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Document type:
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ECN-RX--02-052
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Conference Paper
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Number of pages:
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Full text:
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4
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Download PDF
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Presented at: PV in Europe - From PV Technology to Energy Solutions Conference and Exhibition, Rome, Italy, 7-11 oktober 2002.
Abstract:
Thin crystalline silicon solar cells interconnected with standard solderingtechniques warp and have a high change of breaking. Therefore, thin
cells should be interconnected with conductive adhesives: warping can
be avoided and 80µm thin cells do not break during and after interconnection
unlike soldered cells. Damp/heat tests and temperature cycling show
no degradation.Tested mini modules made with soldered back contacts
and glued front contacts show excellent performance even after over
900 cycles. Contact resistances measured on glued interconnections are
similar to soldered contacts. I-V measurements of interconnected thin
back-contact cells in mini modules show no loss in fill factor. Interconnection
with conductive adhesives is a promising technique combining excellent
mechanical properties, good conductivity, durability, and low process
temperatures thus reducing stress.
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