ECN publication
Title:
Low-stress interconnection for solar cells
 
Author(s):
 
Published by: Publication date:
ECN Solar Energy 1-6-2005
 
ECN report number: Document type:
ECN-RX--05-006 Conference Paper
 
Number of pages: Full text:
4 Download PDF  

Presented at: 20th European Photovoltaic Solar Energy Conference and Exhibition, Barcelona, Spain, 6-10 juni 2005.

Abstract:

Standard soldering techniques applied to large and thin silicon solar cells can lead to cell breakage because of mechanical stresses. Several alternative stress-free interconnection technologies have been explored: mechanical contacting and physical joining by means of electrically conductive adhesives. A mechanical contacting technology relying purely on contact pressure exerted by magnets was investigated. This technology is truly stress-free because there is no means of physical joining of the tabs with the cell. Durable contacts can be manufactured using this technique. It was shown however, that this method does not give reliable results after EVA encapsulation. The EVA encapsulant underflows the tab which leads to unstable contact resistances. Interconnection with conductive adhesives performs excellently. Recent development of flexible conductive adhesives has greatly increased the reliability of the adhesive bond. Low process temperatures lead to low-stress interconnections with excellent mechanical properties, conductivity and durability.


Back to List