ECN publication
Simulation assisted design of a PV module incorporating electrically conductive adhesive interconnections
Meuwissen, M.; Nieuwenhof, M. van den; Steijvers, H.L.A.H.; Bots, T.L.; Broek, K.M.; Kloos, M.J.H.
Published by: Publication date:
ECN Solar Energy 11-9-2006
ECN report number: Document type:
ECN-RX--06-039 Conference Paper
Number of pages: Full text:
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Presented at: 21st European Photovoltaic Solar Energy Conference and Exhibition, Dresden, Germany, 4-8 september 2006.

Crystalline cells used in PV modules are becoming thinner, while at the same time the surface area increases. This trend is mainly driven by cost efficiency. Due to the higher fragility of thin solar cells, the admissible limits on mechanical stresses during assembly and during field operation are lower. Nowadays, solar modules are typically assembled using soldered interconnects. The soldering process induces a combination of thermal and mechanical loads on the cell. For thin cells, these loads are expected to lead to unacceptably high breakage levels during module production. By applying conductive adhesives, the thermo-mechanical loads are reduced. The back-contacted cell concept [1][2] allows for a relatively straightforward introduction of adhesive interconnects into a PV module. An important issue in the design of PV modules is its long term thermo-mechanical reliability. The paper presents the application of computer simulation techniques in addressing this issue. It highlights critical aspects for performing accurate simulations of thermo-mechanical PV module behaviour. The simulation techniques are demonstrated on the design of a suitable adhesive interconnect size in a PV laminate that is subjected to temperature cycling.

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