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Title:
Beyond 16% efficient back-contact modules using Mc-Si wafers and conductive adhesive interconnection technology

Author(s):
Jong, P.C. de; Broek, K.M.; Kloos, M.J.H.; Späth, M.; Nieuwenhof, M.A.C.J. van den; Steijvers, H.L.A.H.; Meuwissen, M.H.H.

Published by:	Publication date:
ECN Solar Energy	29-1-2007

ECN report number:	Document type:
ECN-M--07-016	Conference Paper

Number of pages:	Full text:
0	Download PDF

Presented at: 22nd European Photovoltaic Solar Energy Conference and Exhibition, Milan, Italy, 3-7 september 2007.

Abstract:
n.v.t.