ECN publication
Title:
How conductive adhesives contribute to hetero-junction module technology
 
Author(s):
 
Published by: Publication date:
ECN Solar Energy 3-12-2011
 
ECN report number: Document type:
ECN-M--11-107 Conference Paper
 
Number of pages: Full text:
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Presented at: 17th International Photovoltaic Science and Engineering Conference (PVSEC17), Fukuoka, Japan, 3-7 december 2007.

Abstract:
Silicon hetero-junction solar cell technology has the potential to obtain high efficiencies with thin wafers. This requires low stress and low-temperature interconnection of individual cells at module level. Also, hetero-junction cells are known to be susceptible to moisture ingress inside the module. Single cell modules have been manufactured using conductive adhesive as interconnection and using moisture blocking back sheet to protect the cells. The series resistance losses due to conductive adhesives are very low while the optical losses in the module were negligible. The modules have been exposed to climate chamber tests (damp-heat and thermal cycling) according to the IEC 61215 ed. 2 standard. Modules made with moisture blocking back-sheets showed that the modules did survive 1500 hours (1.5 times IEC) of damp heat and over 340 thermal cycles with less than 5% reduction in power output. The industrial feasibility of this module technology was demonstrated by manufacturing 72-cell modules, using cells obtained from an industrial party.


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