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Title:
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Metal wrap through silicon heterojunction solar cells and first made minimodules
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Author(s):
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Wu, Y.; Aken, B.B. van; Janssen, G.J.M.; Loffler, J.; Li, F.; Shen, Y.; Yang, W.; Shi, J.; Li, Gaofei; Hu, Zhiyan; Xiong, Jingfeng; Coletti, G.
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Published by:
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Publication date:
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ECN
Solar Energy
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22-9-2014
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ECN report number:
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Document type:
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ECN-M--14-048
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Conference Paper
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Number of pages:
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Full text:
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6
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Download PDF
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Abstract:
In this paper we present the successful integration of a silicon heterojunction (HJ) solar cell with metal wrap through architecture (MWT) and foil based- back contact module technology. With this contribution we show a record cell efficiency of 20.3% achieved using commercial n-type Cz 6 inch wafers and demonstrate an encapsulated cell efficiency of 19.6% achieved on a 2×2 mini-module. To our knowledge this is the first time that module results of MWT-HJ architecture have been reported. In this studies , we propose a method to increase the solar cell performance up to 21% together with a 50% cost of ownership reduction of the front silver metal including via and conductive adhesive. This is possible solely by the optimization of the front metal grid. MWT-HJ is a fully low-temperature integrated cell and module concept compatible also with thinner wafers.
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