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ECN publication
Title:
Metallisation patterns for interconnection through holes
 
Author(s):
Burgers, A.R.; Bultman, J.H.; Tip, A.C.; Sinke, W.C.
 
Published by: Publication date:
ECN Solar Energy 1-2-2000
 
ECN report number: Document type:
ECN-RX--99-031 Article (scientific)
 
Number of pages:
6  

Published in: Solar Energy Materials & Solar Cells (Elsevier), , , Vol., p.-.

Abstract:
ECN has developed a new cell and module design for crystalline siliconsolar cells called PUM (pin-up module). In this design a limited number of holes (typically 9 or 16) is used to interconnect the front side metallization to a foil at the rear side by using pins. In this way the bus bars and tabs at the front side are eliminated resulting in several important benefits. The efficiency of the cell becomes independent of the cell area and the efficiency is higher compared to standard tabbed cells. Another benefit is the visual appearance. In this paper we discuss the design of the metallization pattern for the cells. A theoretical analysis is presented that shows the gains of the PUM design over conventional cells. 10 refs.


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