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Title:
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Selecting optimal interconnection methodology for easy and cost efficient manufacturing of the pin up module
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Author(s):
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Bultman, J.H.; Eikelboom, D.W.K.; Kinderman, R.; Tip, A.C.; Weeber, A.W.; Meuwissen, M.H.H.; Nieuwenhof, M.A.C.J. van den; Michiels, P.P.; Schoofs, C.; Schuurmans, F.M.
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Published by:
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Publication date:
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ECN
Solar Energy
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1-10-2002
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ECN report number:
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Document type:
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ECN-RX--02-051
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Conference Paper
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Number of pages:
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Full text:
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4
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Download PDF
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Presented at: PV in Europe - From PV Technology to Energy Solutions Conference and Exhibition, Rome, Italy, 7-11 oktober 2002.
Abstract:
Rear contacted solar cells are successfully glued onto an interconnectionfoil which also serves as the environmental barrier at the rear of the
module. Resulting fill factors are similar to cells connected with strips
that are soldered and glued. Glued cells are interconnected and laminated
in a single step, which reduces labor to a minimum, reduces stress on
the cells, and therefore could increase process yield. Considering these
advantages, this concept has the potential to interconnect very thin
cells without additional stress on the cells.
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