|
Title:
|
|
Low-stress interconnection for solar cells
|
|
|
|
Author(s):
|
|
|
|
|
|
Published by:
|
Publication date:
|
|
ECN
Solar Energy
|
1-6-2005
|
|
|
|
ECN report number:
|
Document type:
|
|
ECN-RX--05-006
|
Conference Paper
|
|
|
|
Number of pages:
|
Full text:
|
|
4
|
Download PDF
|
Presented at: 20th European Photovoltaic Solar Energy Conference and Exhibition, Barcelona, Spain, 6-10 juni 2005.
Abstract:
Standard soldering techniques
applied to large and thin silicon solar cells can lead to cell breakage
because of mechanical stresses. Several alternative stress-free interconnection
technologies have been explored: mechanical contacting and physical
joining by means of electrically conductive adhesives. A mechanical
contacting technology relying purely on contact pressure exerted by
magnets was investigated. This technology is truly stress-free because
there is no means of physical joining of the tabs with the cell. Durable
contacts can be manufactured using this technique. It was shown however,
that this method does not give reliable results after EVA encapsulation.
The EVA encapsulant underflows the tab which leads to unstable contact
resistances. Interconnection with conductive adhesives performs excellently.
Recent development of flexible conductive adhesives has greatly increased
the reliability of the adhesive bond. Low process temperatures lead
to low-stress interconnections with excellent mechanical properties,
conductivity and durability.
Back to List