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Title:
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Lead free metallisation for silicon solar cells: results from the EC2Contact project
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Author(s):
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Hoornstra, J.; Broek, K.M.; Granek, F.J.; Schubert, G.; LePrince, C.; Whal, G.; Lenkeit, B.; Horzel, J.
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Published by:
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Publication date:
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ECN
Solar Energy
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1-6-2005
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ECN report number:
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Document type:
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ECN-RX--05-017
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Conference Paper
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Number of pages:
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Full text:
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4
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Download PDF
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Presented at: 20th European Photovoltaic Solar Energy Conference and Exhibition, Barcelona, Spain, 6-10 juni 2005.
Abstract:
This
paper reports the successful development
of lead free thick film metallisation pastes for contacting crystalline
silicon solar cells, as performed in the EC2Contact project. Due to
detailed characterization, we now understand the process of contact
formation of front side metallisation pastes to silicon. New test procedures
have reduced the number of experiments. Silver pastes with lead free
glass frits were formulated on basis of the contact model and tested
using the new approaches. Cells were produced on texturized Cz crystalline
silicon and SiNx
anti reflection coating. Using the best lead free silver front side
paste, a fill factor of 77.2% and
efficiency of 17.0% was reached,
equal to results from a reference paste using leaded frit. The best
rear side aluminium paste with lead free frit performed similar as compared
to the reference aluminium paste with 76.5% FF and 17.1% efficiency
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