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ECN publication
Title:
Impact of materials on back-contact module reliability
 
Author(s):
Guichoux, M.G.; Tjengdrawira, C.; Veldman, D.; Jong, P.C. de
 
Published by: Publication date:
ECN Solar Energy 21-6-2010
 
ECN report number: Document type:
ECN-M--10-028 Conference Paper
 
Number of pages: Full text:
4 Download PDF  

Presented at: 35th IEEE Photovoltaic Specialist Conference, Honolulu, USA, 20-25 juni 2010.

Abstract:
This paper discusses the impact of several combinations of encapsulants, conductive adhesives and back-sheet foils on ECN’s back-contact modules performance and reliability. Damp-heat (85°C; 85% R.H) and thermal cycling (-40°C; +85°C) tests were performed up to twice as long as described in the IEC-61215 standard, i.e. 2000 hours of damp-heat and 400 thermal cycles. These tests have been identified as the most important tests for this technology. After climatic chamber testing, the modules were analyzed visually and by electro-luminescence imaging.


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