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Publications from author Budel, T. 
Bosman, J.; Budel, T.; Kok, C.J.G.M. de;
Back-end interconnection, a generic concept for high volume manufacturing
ECN-M--13-032 EN september 2013; 4 pag.
Slooff, L.H.; Bosman, J.; Loffler, J.; Budel, T.;
Cost reduction by using micro-fingers in thin film silicon modules
ECN-M--13-008 EN juni 2013; 3 pag.
Veenstra, S.C.; Grossiord, N.; Galagan, Y.; Andriessen, R.; Blom, P.; Verhees, W.J.H.; Budel, T.; Slooff, L.H.; Kroon, J.M.;
Towards an all-solution processed polymer solar cell
ECN-M--11-018 EN september 2011; 4 pag.