ECN Publications

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Publications from author Budel, T.
Bosman, J.; Budel, T.; Kok, C.J.G.M. de; Back-end interconnection, a generic concept for high volume manufacturing ECN-M--13-032 september 2013; 4 pag.

Slooff, L.H.; Bosman, J.; Loffler, J.; Budel, T.; Cost reduction by using micro-fingers in thin film silicon modules ECN-M--13-008 juni 2013; 3 pag.

Veenstra, S.C.; Grossiord, N.; Galagan, Y.; Andriessen, R.; Blom, P.; Verhees, W.J.H.; Budel, T.; Slooff, L.H.; Kroon, J.M.; Towards an all-solution processed polymer solar cell ECN-M--11-018 september 2011; 4 pag.