ECN publication
Title:
Mechanical Strength of Silicon Wafers depending on Wafer Thickness and Surface Treatment
 
Author(s):
 
Published by: Publication date:
ECN Solar Energy 11-9-2006
 
ECN report number: Document type:
ECN-RX--06-032 Conference Paper
 
Number of pages: Full text:
4 Download PDF  

Presented at: 21st European Photovoltaic Solar Energy Conference and Exhibition, Dresden, Germany, 4-8 september 2006.

Abstract:
Mechanical stability of wafers with thickness between 120 and 320 mm is tested with ring on ring breakage tester. A linear relationship between breakage force F and thickness is found, instead of quadratic as theory predicts. Therefore thinner wafers tolerate a higher force than expected. Thinner wafers bend and stretch due to the increased flexibility, redistributing the stress inside the wafer. The effect of different isotexturing recipes on the mechanical stability is analysed. The resulting wafer strength distributions follow a Weibull function as expected from literature.


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