ECN publication
Wet chemical etching for crystalline silicon solar cells
Published by: Publication date:
ECN Solar Energy 19-6-2006
ECN report number: Document type:
ECN-RX--06-064 Conference Paper
Number of pages: Full text:
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Presented at: 5th International Workshop on Physical Chemistry of Wet Etching of Semiconductors PCWECS, Saarbrücken, Germany, 19-21 juni 2006.

Alkaline etching is frequently used in the processing of silicon into solar cells. High temperatures (above 100°C) and concentrations (> 10 M) of typically NaOH or KOH solutions are used for the fast removal of saw-damage for the wafers as-cut from the ingot. At low concentrations (less than 10 M) and temperatures (< 100°C) these solutions are used particularly on monocrystalline (100) oriented silicon wafers for the formation pyramidal etch structures having excellent anti-reflective properties.

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