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Title:
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Back-end interconnection, a generic concept for high volume manufacturing
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Author(s):
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Published by:
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Publication date:
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ECN
Solar Energy
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30-9-2013
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ECN report number:
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Document type:
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ECN-M--13-032
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Conference Paper
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Number of pages:
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Full text:
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4
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Download PDF
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Abstract:
The general method to realize series connection in thin film PV modules is monolithical interconnection through a sequence of laser scribes (P1, P2 and P3) and layer depositions. This method however implies that the deposition processes are interrupted several times, an undesirable situation in high volume processing. In order to eliminate this drawback we focus our developments on the so called “back-end interconnection concept” in which series interconnection takes place AFTER the deposition of the functional layers of the thin film PV device.
The process of making a back-end interconnection combines laser scribing, curing, sintering and inkjet processes. These different processes interacts with each other and are investigated in order to create processing strategies that are robust to ensure high volume production. The generic approach created a technology base that can be applied to any thin film PV technology.
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